Universal H300 is a 12-inch CMP equipment developed based on HWATSING's independent intellectual property innovation technology,equipped with innovative polishing and cleaning units, it greatly improves production efficiency and polishing performance, increases process flexibility, and meets various process requirements. It is widely used in integrated circuits, advanced packaging, large silicon wafers and other manufacturing processes.
High WPH、high performance and high reliability
Multi-section polishing head
Dry-in and dry out
Satisfy mature process technology requirements
Used for CMP processes such as Oxide/SiN/STI/Poly/Cu/W