The Universal-150 W is a mature 6-inch CMP device developed for the needs of rapidly growing emerging markets. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing units, compatible with 4/6 inch wafers, suitable for a variety of materials, dry in and wet out products. The device has a small footprint, high output efficiency, and can achieve ultra-high wafer surface flatness, meet the needs of mature process technology, and is widely used in the third generation semiconductor, MEMS and other manufacturing processes.